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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-3518-10H

06-3518-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2543 1.76
- +

Arabaya ekle

İstem şimdi

06-3518-10H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10T

18-3518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2131 1.76
- +

Arabaya ekle

İstem şimdi

18-3518-10T

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
114-83-328-41-134191

114-83-328-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3026 1.69
- +

Arabaya ekle

İstem şimdi

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-328-41-003101

115-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2738 1.64
- +

Arabaya ekle

İstem şimdi

115-83-328-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-318-41-001101

121-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2609 1.64
- +

Arabaya ekle

İstem şimdi

121-83-318-41-001101

Datenblatt

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-428-41-117101

114-83-428-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2834 1.64
- +

Arabaya ekle

İstem şimdi

114-83-428-41-117101

Datenblatt

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-430-41-005101

117-83-430-41-005101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

2344 1.64
- +

Arabaya ekle

İstem şimdi

117-83-430-41-005101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-318-41-001101

122-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3215 1.64
- +

Arabaya ekle

İstem şimdi

122-83-318-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-318-41-001101

123-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3044 1.64
- +

Arabaya ekle

İstem şimdi

123-83-318-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-08-000101

510-87-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

3573 1.65
- +

Arabaya ekle

İstem şimdi

510-87-064-08-000101

Datenblatt

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-324-41-105101

110-83-324-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2736 1.65
- +

Arabaya ekle

İstem şimdi

110-83-324-41-105101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-008101

116-83-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2959 1.65
- +

Arabaya ekle

İstem şimdi

116-83-316-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-314-STT

ICO-314-STT

CONN IC DIP SOCKET 14POS TIN

Samtec Inc.

2586 1.77
- +

Arabaya ekle

İstem şimdi

ICO-314-STT

Datenblatt

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-87-324-41-012101

116-87-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2052 1.66
- +

Arabaya ekle

İstem şimdi

116-87-324-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-0518-10H

12-0518-10H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2505 1.78
- +

Arabaya ekle

İstem şimdi

12-0518-10H

Datenblatt

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-10H

12-1518-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2366 1.78
- +

Arabaya ekle

İstem şimdi

12-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-316-41-011101

116-87-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2316 1.66
- +

Arabaya ekle

İstem şimdi

116-87-316-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-018101

116-83-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2483 1.66
- +

Arabaya ekle

İstem şimdi

116-83-322-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-013101

116-83-308-41-013101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3465 1.67
- +

Arabaya ekle

İstem şimdi

116-83-308-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-424-41-001101

612-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3877 1.67
- +

Arabaya ekle

İstem şimdi

612-87-424-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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