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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
02-0503-21

02-0503-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3463 1.89
- +

Arabaya ekle

İstem şimdi

02-0503-21

Datenblatt

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0503-31

02-0503-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2379 1.89
- +

Arabaya ekle

İstem şimdi

02-0503-31

Datenblatt

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
03-0503-20

03-0503-20

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3507 1.89
- +

Arabaya ekle

İstem şimdi

03-0503-20

Datenblatt

Bulk 0503 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
03-0503-30

03-0503-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2397 1.89
- +

Arabaya ekle

İstem şimdi

03-0503-30

Datenblatt

Bulk 0503 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-1518-10T

14-1518-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3462 1.89
- +

Arabaya ekle

İstem şimdi

14-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3513-10T

14-3513-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2122 1.89
- +

Arabaya ekle

İstem şimdi

14-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-210-41-013101

116-87-210-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2221 1.77
- +

Arabaya ekle

İstem şimdi

116-87-210-41-013101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-012101

116-87-424-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2741 1.94
- +

Arabaya ekle

İstem şimdi

116-87-424-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-012101

116-87-624-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3041 1.77
- +

Arabaya ekle

İstem şimdi

116-87-624-41-012101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-008101

116-87-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2984 1.89
- +

Arabaya ekle

İstem şimdi

116-87-322-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-632-41-001101

612-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3796 1.94
- +

Arabaya ekle

İstem şimdi

612-87-632-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-432-41-005101

110-83-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2028 1.77
- +

Arabaya ekle

İstem şimdi

110-83-432-41-005101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-004101

116-87-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2754 1.78
- +

Arabaya ekle

İstem şimdi

116-87-314-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-210-10-001101

299-83-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3684 1.78
- +

Arabaya ekle

İstem şimdi

299-83-210-10-001101

Datenblatt

Bulk 299 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-065-10-051101

510-87-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

2158 1.79
- +

Arabaya ekle

İstem şimdi

510-87-065-10-051101

Datenblatt

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-065-10-052101

510-87-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

3736 1.79
- +

Arabaya ekle

İstem şimdi

510-87-065-10-052101

Datenblatt

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-6513-10T

10-6513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2209 1.91
- +

Arabaya ekle

İstem şimdi

10-6513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-11H

06-0518-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3834 1.91
- +

Arabaya ekle

İstem şimdi

06-0518-11H

Datenblatt

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-11H

06-1518-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2546 1.91
- +

Arabaya ekle

İstem şimdi

06-1518-11H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10H

13-0518-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3225 1.91
- +

Arabaya ekle

İstem şimdi

13-0518-10H

Datenblatt

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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