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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
2207 | 2.35 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
11-0513-10HCONN SOCKET SIP 11POS GOLD |
3004 | 2.52 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 0513 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-0518-11CONN SOCKET SIP 15POS GOLD |
2397 | 2.52 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-0518-10CONN SOCKET SIP 22POS GOLD |
2972 | 2.52 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-83-422-41-002101CONN IC DIP SOCKET 22POS GOLD |
3672 | 2.37 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-83-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
3442 | 2.37 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 612 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
117-83-428-41-105101CONN IC DIP SOCKET 28POS GOLD |
2195 | 2.38 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-322-41-009101CONN IC DIP SOCKET 22POS GOLD |
2648 | 2.54 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
09-0518-00CONN SOCKET SIP 9POS GOLD |
3782 | 2.54 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
117-83-642-41-005101CONN IC DIP SOCKET 42POS GOLD |
2655 | 2.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
06-2513-10HCONN IC DIP SOCKET 6POS GOLD |
3332 | 2.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-3513-11CONN IC DIP SOCKET 12POS GOLD |
2695 | 2.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-0517-90CCONN SOCKET SIP 6POS GOLD |
3480 | 2.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 0517 | Active | SIP | 6 (1 x 6) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
115-83-636-41-001101CONN IC DIP SOCKET 36POS GOLD |
3315 | 2.39 |
Arabaya ekleİstem şimdi |
Bulk | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
146-83-424-41-035101CONN IC DIP SOCKET 24POS GOLD |
2133 | 2.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 146 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-83-424-41-036101CONN IC DIP SOCKET 24POS GOLD |
2722 | 2.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 146 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
3210 | 2.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-424-41-001101CONN IC DIP SOCKET 24POS GOLD |
3885 | 2.63 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-650-41-003101CONN IC DIP SOCKET 50POS GOLD |
3794 | 2.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-328-41-008101CONN IC DIP SOCKET 28POS GOLD |
3313 | 2.64 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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