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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-3518-00

24-3518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2308 3.98
- +

Arabaya ekle

İstem şimdi

24-3518-00

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-120-41-013000

346-93-120-41-013000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

3940 3.98
- +

Arabaya ekle

İstem şimdi

346-93-120-41-013000

Datenblatt

Tube 346 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-120-41-013000

346-43-120-41-013000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

2773 3.98
- +

Arabaya ekle

İstem şimdi

346-43-120-41-013000

Datenblatt

Tube 346 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-124-13-001101

510-87-124-13-001101

CONN SOCKET PGA 124POS GOLD

Preci-Dip

2047 3.74
- +

Arabaya ekle

İstem şimdi

510-87-124-13-001101

Datenblatt

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-6513-10

20-6513-10

IC SOCK COLLET CT 20 PIN GOLD

Aries Electronics

3917 4.00
- +

Arabaya ekle

İstem şimdi

- 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10

24-0513-10

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3445 4.00
- +

Arabaya ekle

İstem şimdi

24-0513-10

Datenblatt

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-636-41-002101

116-87-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3472 3.77
- +

Arabaya ekle

İstem şimdi

116-87-636-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-125-13-041101

510-87-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip

3024 3.77
- +

Arabaya ekle

İstem şimdi

510-87-125-13-041101

Datenblatt

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-6511-10

10-6511-10

SOCKET 10 POS SOLDER TAIL TIN

Aries Electronics

2704 4.01
- +

Arabaya ekle

İstem şimdi

- 511 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
540-44-044-17-400004

540-44-044-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

2450 4.02
- +

Arabaya ekle

İstem şimdi

540-44-044-17-400004

Datenblatt

Tape & Reel (TR) 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
116-83-432-41-002101

116-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2137 3.78
- +

Arabaya ekle

İstem şimdi

116-83-432-41-002101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-002101

116-83-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3336 3.90
- +

Arabaya ekle

İstem şimdi

116-83-632-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-6513-10H

10-6513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2270 4.02
- +

Arabaya ekle

İstem şimdi

10-6513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10H

29-0518-10H

CONN SOCKET SIP 29POS GOLD

Aries Electronics

3339 4.02
- +

Arabaya ekle

İstem şimdi

29-0518-10H

Datenblatt

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-324-11-001101

299-87-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3888 3.79
- +

Arabaya ekle

İstem şimdi

299-87-324-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-0511-10

08-0511-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

3421 4.03
- +

Arabaya ekle

İstem şimdi

08-0511-10

Datenblatt

Bulk 511 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10H

18-3518-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3440 4.03
- +

Arabaya ekle

İstem şimdi

18-3518-10H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-83-614-10-002101

299-83-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2937 3.80
- +

Arabaya ekle

İstem şimdi

299-83-614-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-640-41-001101

122-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2368 3.80
- +

Arabaya ekle

İstem şimdi

122-87-640-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-640-41-001101

123-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3026 3.80
- +

Arabaya ekle

İstem şimdi

123-87-640-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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