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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-3513-11H

20-3513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2918 8.02
- +

Arabaya ekle

İstem şimdi

20-3513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0511-10

22-0511-10

CONN SOCKET SIP 22POS TIN

Aries Electronics

3270 8.02
- +

Arabaya ekle

İstem şimdi

22-0511-10

Datenblatt

Bulk 511 Active SIP 22 (1 x 22) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-83-628-10-002101

299-83-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3596 8.09
- +

Arabaya ekle

İstem şimdi

299-83-628-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-304-31-018000

614-41-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2173 8.03
- +

Arabaya ekle

İstem şimdi

614-41-304-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-31-018000

614-91-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2074 8.03
- +

Arabaya ekle

İstem şimdi

614-91-304-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-6823-90T

12-6823-90T

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

3853 8.04
- +

Arabaya ekle

İstem şimdi

12-6823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
32-6518-10H

32-6518-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3042 8.04
- +

Arabaya ekle

İstem şimdi

32-6518-10H

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6823-90TWR

10-6823-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3650 8.04
- +

Arabaya ekle

İstem şimdi

10-6823-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-0517-90C

18-0517-90C

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3127 8.04
- +

Arabaya ekle

İstem şimdi

18-0517-90C

Datenblatt

Bulk 0517 Active SIP 18 (1 x 18) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-10E

20-3518-10E

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2683 8.04
- +

Arabaya ekle

İstem şimdi

20-3518-10E

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-652-41-011101

116-83-652-41-011101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2033 8.54
- +

Arabaya ekle

İstem şimdi

116-83-652-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-304-31-007000

614-41-304-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2116 8.05
- +

Arabaya ekle

İstem şimdi

614-41-304-31-007000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-31-007000

614-91-304-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2480 8.05
- +

Arabaya ekle

İstem şimdi

614-91-304-31-007000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-144-41-013000

346-93-144-41-013000

CONN SOCKET SIP 44POS GOLD

Mill-Max Manufacturing Corp.

2053 8.05
- +

Arabaya ekle

İstem şimdi

346-93-144-41-013000

Datenblatt

Bulk 346 Active SIP 44 (1 x 44) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-144-41-013000

346-43-144-41-013000

CONN SOCKET SIP 44POS GOLD

Mill-Max Manufacturing Corp.

2824 8.05
- +

Arabaya ekle

İstem şimdi

346-43-144-41-013000

Datenblatt

Bulk 346 Active SIP 44 (1 x 44) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-304-41-001000

614-41-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3961 8.05
- +

Arabaya ekle

İstem şimdi

614-41-304-41-001000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-41-001000

614-91-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3334 8.05
- +

Arabaya ekle

İstem şimdi

614-91-304-41-001000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-064-08-000112

614-83-064-08-000112

CONN SOCKET PGA 64POS GOLD

Preci-Dip

2787 7.61
- +

Arabaya ekle

İstem şimdi

614-83-064-08-000112

Datenblatt

Bulk 614 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-2823-90C

10-2823-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3934 8.07
- +

Arabaya ekle

İstem şimdi

10-2823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9513-10T

50-9513-10T

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3307 8.07
- +

Arabaya ekle

İstem şimdi

50-9513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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