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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
03-7630-10

03-7630-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2914 8.73
- +

Arabaya ekle

İstem şimdi

03-7630-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
03-7880-10

03-7880-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

3895 8.73
- +

Arabaya ekle

İstem şimdi

03-7880-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-0503-21

10-0503-21

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2733 8.73
- +

Arabaya ekle

İstem şimdi

10-0503-21

Datenblatt

Bulk 0503 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
10-0503-31

10-0503-31

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3981 8.73
- +

Arabaya ekle

İstem şimdi

10-0503-31

Datenblatt

Bulk 0503 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
24-6501-20

24-6501-20

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

3705 8.73
- +

Arabaya ekle

İstem şimdi

24-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-30

24-6501-30

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2580 8.73
- +

Arabaya ekle

İstem şimdi

24-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-168-17-001101

510-83-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

3789 8.29
- +

Arabaya ekle

İstem şimdi

510-83-168-17-001101

Datenblatt

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-168-17-101101

510-83-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

3202 8.29
- +

Arabaya ekle

İstem şimdi

510-83-168-17-101101

Datenblatt

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-168-17-102101

510-83-168-17-102101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

2644 8.29
- +

Arabaya ekle

İstem şimdi

510-83-168-17-102101

Datenblatt

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
31-0518-11H

31-0518-11H

CONN SOCKET SIP 31POS GOLD

Aries Electronics

3613 8.75
- +

Arabaya ekle

İstem şimdi

31-0518-11H

Datenblatt

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0511-10

35-0511-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2133 8.76
- +

Arabaya ekle

İstem şimdi

35-0511-10

Datenblatt

Bulk 511 Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-99-210-12-001800

299-99-210-12-001800

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

3826 8.76
- +

Arabaya ekle

İstem şimdi

299-99-210-12-001800

Datenblatt

Tube 299 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-179-15-041101

510-83-179-15-041101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2733 8.30
- +

Arabaya ekle

İstem şimdi

510-83-179-15-041101

Datenblatt

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-18-111101

510-83-180-18-111101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2185 8.30
- +

Arabaya ekle

İstem şimdi

510-83-180-18-111101

Datenblatt

Bulk 510 Active PGA 180 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-068-10-061112

614-83-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2728 8.33
- +

Arabaya ekle

İstem şimdi

614-83-068-10-061112

Datenblatt

Bulk 614 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
31-0511-10

31-0511-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3086 8.78
- +

Arabaya ekle

İstem şimdi

31-0511-10

Datenblatt

Bulk 511 Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0508-20

19-0508-20

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3244 8.78
- +

Arabaya ekle

İstem şimdi

19-0508-20

Datenblatt

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
19-0508-30

19-0508-30

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2962 8.78
- +

Arabaya ekle

İstem şimdi

19-0508-30

Datenblatt

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
40-6518-102

40-6518-102

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3079 8.78
- +

Arabaya ekle

İstem şimdi

40-6518-102

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-148-41-013000

346-93-148-41-013000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

2509 8.78
- +

Arabaya ekle

İstem şimdi

346-93-148-41-013000

Datenblatt

Bulk 346 Active SIP 48 (1 x 48) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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