Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1825109-3CONN IC DIP SOCKET 40POS GOLD |
2120 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
1825276-2CONN IC DIP SOCKET 32POS GOLD |
2652 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
1825376-2CONN IC DIP SOCKET 28POS GOLD |
2901 | 1.35 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD |
2548 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | |
110-024-000CONN IC DIP SOCKET 24POS GOLD |
2036 | 0.00 |
Arabaya ekleİstem şimdi |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | ||
130-024-000CONN IC DIP SOCKET 24POS GOLD |
2535 | 0.00 |
Arabaya ekleİstem şimdi |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | ||
130-028-000CONN IC DIP SOCKET 28POS GOLD |
2568 | 0.00 |
Arabaya ekleİstem şimdi |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | ||
300-014-000CONN SOCKET SIP 14POS GOLD |
3234 | 0.00 |
Arabaya ekleİstem şimdi |
- | 300 | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
300-032-000CONN SOCKET SIP 32POS GOLD |
2468 | 0.00 |
Arabaya ekleİstem şimdi |
- | 300 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
400-028-000CONN IC DIP SOCKET 28POS GOLD |
2636 | 0.00 |
Arabaya ekleİstem şimdi |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
400-032-000CONN IC DIP SOCKET 32POS GOLD |
3776 | 0.00 |
Arabaya ekleİstem şimdi |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
400-040-000CONN IC DIP SOCKET 40POS GOLD |
2974 | 0.00 |
Arabaya ekleİstem şimdi |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
500-032-000CONN SOCKET SIP 32POS GOLD |
3542 | 0.00 |
Arabaya ekleİstem şimdi |
- | - | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | ||
210-33-628-41-101000SOCKET IC CLOSED FRM .300 28POS |
2785 | 0.00 |
Arabaya ekleİstem şimdi |
Tube | 210 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
210-33-640-41-101000SOCKET IC CLOSED FRM .600 28POS |
3301 | 0.00 |
Arabaya ekleİstem şimdi |
Tube | 210 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
SIP1X06-014BLFCONN SOCKET SIP 6POS TIN |
2152 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
SIP1X05-014BLFCONN SOCKET SIP 5POS TIN |
2853 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD |
3812 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
SIP1X07-014BLFCONN SOCKET SIP 7POS TIN |
2500 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD |
3065 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
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