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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7-1437539-0CONN IC DIP SOCKET 24POS GOLD |
3486 | 1.71 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 800 | Obsolete | DIP, 0.5 to 0.6 Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
7-1437539-7CONN IC DIP SOCKET 24POS GOLD |
3842 | 0.88 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
2-1571551-9CONN IC DIP SOCKET 28POS GOLD |
2753 | 3.15 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Box | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-1571586-3CONN IC DIP SOCKET 14POS GOLD |
2240 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-1571586-6CONN IC DIP SOCKET 20POS GOLD |
2937 | 2.84 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk,Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571586-9CONN IC DIP SOCKET 28POS GOLD |
3969 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
3-1571586-0CONN IC DIP SOCKET 32POS GOLD |
3032 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
4-1571551-2CONN IC DIP SOCKET 8POS GOLD |
3252 | 1.80 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
528-AG10D-ESCONN IC DIP SOCKET 28POS GOLD |
3165 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
643661-3CONN SOCKET SIP 29POS TIN |
2071 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tray | Diplomate DL | Active | SIP | 29 (1 x 29) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
508-AG10DCONN IC DIP SOCKET 8POS GOLD |
2858 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | - |
|
5-1571552-0CONN IC DIP SOCKET 32POS GOLD |
2077 | 3.33 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
5-1437536-2CONN IC DIP SOCKET 28POS GOLD |
3811 | 6.68 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
1571541-4CONN SOCKET PLCC 84POS TIN |
2823 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | PCS | Obsolete | PLCC | 84 (4 x 21) | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
514-AG10DCONN IC DIP SOCKET 14POS GOLD |
2684 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
1571541-2CONN SOCKET PLCC 52POS TIN |
2948 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | PCS | Obsolete | PLCC | 52 (4 x 13) | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
4-1571551-9CONN IC DIP SOCKET 28POS GOLD |
2690 | 4.73 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube,Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1761505-1CONN SOCKET PGA ZIF 604POS GOLD |
2607 | 0.00 |
Arabaya ekleİstem şimdi |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 604 (25 x 31) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | - | Surface Mount | Open Frame | - | - | - | - | - | - | |
|
516-AG10DCONN IC DIP SOCKET 16POS GOLD |
2965 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
1571540-1CONN SOCKET PLCC 32POS TIN |
3003 | 0.00 |
Arabaya ekleİstem şimdi |
Bulk | - | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
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