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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCC-084-T-N-TRCONN SOCKET PLCC 84POS TIN |
3406 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tape & Reel (TR) | PLCC | Obsolete | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
|
22-11CONN SOCKET TRANSIST 4POS GOLD |
2947 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 22 | Obsolete | Transistor | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
22-16-2CONN SOCKET TRANSIST 3POS GOLD |
2521 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 22 | Obsolete | Transistor | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
22-16-3CONN SOCKET TRANSIST 3POS GOLD |
3762 | 3.35 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk,Bulk | 22 | Obsolete | Transistor | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
IC-316-SGGCONN IC DIP SOCKET 16POS GOLD |
3249 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | IC | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
IC-316-SGTCONN IC DIP SOCKET 16POS GOLD |
2956 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | IC | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
IC-628-SGGCONN IC DIP SOCKET 28POS GOLD |
3036 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | IC | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
IC-628-SGTCONN IC DIP SOCKET 28POS GOLD |
2311 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | IC | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
ICA-308-SST-HCONN IC DIP SOCKET 8POS GOLD |
2445 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | ICA | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
ICA-328-SGTCONN IC DIP SOCKET 28POS GOLD |
3293 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | ICA | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Liquid Crystal Polymer (LCP) |
|
|
ICO-314-SST-LCONN IC DIP SOCKET 14POS GOLD |
3130 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
4620CONN TRANSIST TO-3 3POS TIN |
3770 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
|
232-1270-01-0602CONN SOCKET PGA ZIF 32POS GOLD |
3459 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Textool™ | Active | PGA, ZIF (ZIP) | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
232-1270-02-0602CONN SOCKET PGA ZIF 32POS GOLD |
3986 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Textool™ | Active | PGA, ZIF (ZIP) | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
239-5605-02-0602CONN ZIG-ZAG 39POS GOLD |
3552 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Zig-Zag | 39 (1 x 19, 1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
1437540-5CONN IC DIP SOCKET 32POS TINLEAD |
3803 | 1.47 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk,Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
0475939000CONN SOCKET LGA 1366POS NICKEL |
2358 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tray | 47594 | Obsolete | LGA | 1366 (32 x 41) | - | Nickel | 3.00µin (0.076µm) | - | Surface Mount | Closed Frame | Solder | - | Nickel | 3.00µin (0.076µm) | - | - |
|
0475940001CONN SOCKET LGA 1366POS GOLD |
2382 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tray | 47594 | Obsolete | LGA | 1366 (32 x 41) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | - | - | - | Liquid Crystal Polymer (LCP) |
|
1-390262-3CONN IC DIP SOCKET 32POS TIN |
2836 | 0.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tape & Reel (TR),Cut Tape (CT),Box | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | - |
|
|
CUSTOM BGACONN SOCKET BGA CUSTOM |
3033 | 0.00 |
Arabaya ekleİstem şimdi |
Datenblatt |
- | Textool™ | Active | BGA | Custom | 0.026 ~ 0.050 (0.65mm ~ 1.27mm) | Custom | Custom | - | Through Hole | Custom | - | - | - | - | - | - |
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