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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-0518-00

06-0518-00

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3156 1.23
- +

Arabaya ekle

İstem şimdi

06-0518-00

Datenblatt

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-00

06-1518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3733 1.23
- +

Arabaya ekle

İstem şimdi

06-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-320-41-018101

116-87-320-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3198 1.14
- +

Arabaya ekle

İstem şimdi

116-87-320-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-012101

116-83-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2792 1.19
- +

Arabaya ekle

İstem şimdi

116-83-210-41-012101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-328-41-003101

115-87-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2364 1.15
- +

Arabaya ekle

İstem şimdi

115-87-328-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-428-41-003101

115-87-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3445 1.19
- +

Arabaya ekle

İstem şimdi

115-87-428-41-003101

Datenblatt

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-308-T-I-TR

ICF-308-T-I-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2132 1.24
- +

Arabaya ekle

İstem şimdi

Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
614-87-320-31-012101

614-87-320-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2325 1.19
- +

Arabaya ekle

İstem şimdi

614-87-320-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
PX-28LCC

PX-28LCC

LEADLESS CHIP CARRIER 28P PBT RO

Kycon, Inc.

3230 1.24
- +

Arabaya ekle

İstem şimdi

Tube PX Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
4608

4608

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

3174 1.24
- +

Arabaya ekle

İstem şimdi

4608

Datenblatt

Bulk - Active Transistor, TO-3 3 (Rectangular) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
116-83-308-41-004101

116-83-308-41-004101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2181 1.16
- +

Arabaya ekle

İstem şimdi

116-83-308-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-007101

116-83-312-41-007101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3381 1.16
- +

Arabaya ekle

İstem şimdi

116-83-312-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-628-41-134161

114-87-628-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2364 1.32
- +

Arabaya ekle

İstem şimdi

114-87-628-41-134161

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-320-41-003101

115-83-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3677 1.21
- +

Arabaya ekle

İstem şimdi

115-83-320-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-420-41-117101

114-83-420-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3295 1.17
- +

Arabaya ekle

İstem şimdi

114-83-420-41-117101

Datenblatt

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-316-41-001101

122-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3441 1.17
- +

Arabaya ekle

İstem şimdi

122-87-316-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-044-08-031101

510-87-044-08-031101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

3320 1.17
- +

Arabaya ekle

İstem şimdi

510-87-044-08-031101

Datenblatt

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-001101

116-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2277 1.18
- +

Arabaya ekle

İstem şimdi

116-83-210-41-001101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-001101

116-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3424 1.18
- +

Arabaya ekle

İstem şimdi

116-83-310-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-01-777101

110-83-328-01-777101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2288 1.18
- +

Arabaya ekle

İstem şimdi

110-83-328-01-777101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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