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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WS991SNL35T4THERMALLY STABLE SOLDER PASTE WS |
2817 | 44.04 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
WBRC63/3732SRA ROSIN FLUX CORE SOLDER, 63/3 |
2405 | 44.99 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD3SW.020 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
3450 | 46.34 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
4900-112GSOLDER LF SN96 21GAUGE .25LBS |
3417 | 46.35 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 4900 | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032 (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 4 oz (113.40g) | 60 Months | - |
|
SMD291SNL250T3SOLDER PASTE SAC305 250G T3 |
2814 | 54.95 |
Arabaya ekleİstem şimdi |
Datenblatt |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
24-6337-9710SOLDER 63/37 20AWG 1LB |
252 | 62.31 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 285 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC2SWLF.031 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP |
3912 | 55.75 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMDSWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
3636 | 56.91 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMDSWLF.020 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
3682 | 57.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
4901-227GSOLDER LF SN99 21GAUGE.5LBS |
2867 | 57.59 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 4901 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032 (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | - |
|
|
24-6337-9718SOLDER RMA FLUX 22AWG 63/37 1LB |
256 | 62.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 285 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDSWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
2320 | 58.17 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
24-6040-0010SOLDER RA 60/40 24AWG 1LB |
2184 | 59.02 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
24-6337-8834SOLDER NO-CLEAN 24AWG 63/37 1LB |
169 | 73.30 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 245 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0018SOLDER RA FLUX 22AWG 60/40 1LB |
200 | 63.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025 (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0026SOLDER FLUX-CORED/44 .031 1LB S |
443 | 54.33 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6337-9713SOLDER RMA FLUX 20AWG 63/37 1LB |
205 | 59.36 |
Arabaya ekleİstem şimdi |
Datenblatt |
Spool | 285 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.031 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP |
2410 | 62.74 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
CQ100GE.020 1LBGERMANIUM DOPED SOLDER WIRE SN/C |
3310 | 64.03 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
NC2SWLF.020 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP |
2565 | 64.03 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
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