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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-87-101-13-001101CONN SOCKET PGA 101POS GOLD |
3467 | 3.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 101 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-101-13-061101CONN SOCKET PGA 101POS GOLD |
3034 | 3.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 101 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
25-0518-10TCONN SOCKET SIP 25POS GOLD |
2771 | 3.24 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-6518-10TCONN IC DIP SOCKET 40POS GOLD |
2751 | 3.24 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-3513-00CONN IC DIP SOCKET 14POS GOLD |
3442 | 3.25 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
299-83-612-10-002101CONN IC DIP SOCKET 12POS GOLD |
2959 | 3.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-83-636-41-001101CONN IC DIP SOCKET 36POS GOLD |
2466 | 3.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-652-41-001101CONN IC DIP SOCKET 52POS GOLD |
3454 | 3.05 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-318-41-004101CONN IC DIP SOCKET 18POS GOLD |
3873 | 3.06 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-322-41-004101CONN IC DIP SOCKET 22POS GOLD |
3000 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-422-41-004101CONN IC DIP SOCKET 22POS GOLD |
3385 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-83-316-10-001101CONN IC DIP SOCKET 16POS GOLD |
3922 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-432-41-003101CONN IC DIP SOCKET 32POS GOLD |
3456 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-632-41-003101CONN IC DIP SOCKET 32POS GOLD |
3513 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-066-11-002101CONN SOCKET PGA 66POS GOLD |
3197 | 3.36 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 66 (11 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-628-41-001101CONN IC DIP SOCKET 28POS GOLD |
3448 | 3.16 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-328-41-001101CONN IC DIP SOCKET 28POS GOLD |
3649 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
3901 | 3.07 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-324-41-105191CONN IC DIP SOCKET 24POS GOLD |
2558 | 3.15 |
Arabaya ekleİstem şimdi |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
121-83-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
3087 | 3.09 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 121 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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