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| Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-87-632-41-007101CONN IC DIP SOCKET 32POS GOLD |
2440 | 3.19 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-964-41-001101CONN IC DIP SOCKET 64POS GOLD |
2576 | 3.20 |
Arabaya ekleİstem şimdi |
Bulk | 115 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
07-0508-30CONN SOCKET SIP 7POS GOLD |
3561 | 3.40 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 508 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
ICA-316-SST.100 SCREW MACHINE DIP SOCKET |
2078 | 3.41 |
Arabaya ekleİstem şimdi |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
|
ICO-318-MTT100 LOW PROFILE SCREW MACHINE D |
3704 | 3.41 |
Arabaya ekleİstem şimdi |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
116-87-648-41-018101CONN IC DIP SOCKET 48POS GOLD |
2289 | 3.31 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
22-3513-10TCONN IC DIP SOCKET 22POS GOLD |
2331 | 3.41 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3518-10ECONN IC DIP SOCKET 8POS GOLD |
2791 | 3.41 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3518-11HCONN IC DIP SOCKET 8POS GOLD |
2959 | 3.41 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-83-632-41-801101CONN IC DIP SOCKET 32POS GOLD |
2424 | 3.22 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
121-83-632-41-001101CONN IC DIP SOCKET 32POS GOLD |
3241 | 3.53 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 121 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-107-12-051101CONN SOCKET PGA 107POS GOLD |
2934 | 3.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 107 (12 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-640-41-105161CONN IC DIP SOCKET 40POS GOLD |
2946 | 3.54 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-640-41-012101CONN IC DIP SOCKET 40POS GOLD |
3929 | 3.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
124-83-324-41-002101CONN IC DIP SOCKET 24POS GOLD |
2807 | 3.55 |
Arabaya ekleİstem şimdi |
Bulk | 124 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
8114LB603GHEATSINK |
2246 | 3.43 |
Arabaya ekleİstem şimdi |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
4-1571552-9CONN IC DIP SOCKET 28POS GOLD |
3362 | 3.43 |
Arabaya ekleİstem şimdi |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-83-328-41-009101CONN IC DIP SOCKET 28POS GOLD |
2810 | 3.55 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
18-6513-10TCONN IC DIP SOCKET 18POS GOLD |
3312 | 3.44 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-0513-10HCONN SOCKET SIP 18POS GOLD |
2128 | 3.44 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 0513 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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