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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-191-18-091101

510-87-191-18-091101

CONN SOCKET PGA 191POS GOLD

Preci-Dip

2292 5.76
- +

Arabaya ekle

İstem şimdi

510-87-191-18-091101

Datenblatt

Bulk 510 Active PGA 191 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-C195-11

14-C195-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3197 6.11
- +

Arabaya ekle

İstem şimdi

14-C195-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-11

14-C280-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3111 6.11
- +

Arabaya ekle

İstem şimdi

14-C280-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81000-310C

06-81000-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3964 6.11
- +

Arabaya ekle

İstem şimdi

06-81000-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81140-310C

06-81140-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2488 6.11
- +

Arabaya ekle

İstem şimdi

06-81140-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-81250-310C

06-81250-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2548 6.11
- +

Arabaya ekle

İstem şimdi

06-81250-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8285-310C

06-8285-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3275 6.11
- +

Arabaya ekle

İstem şimdi

06-8285-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8300-310C

06-8300-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2732 6.11
- +

Arabaya ekle

İstem şimdi

06-8300-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8590-310C

06-8590-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3835 6.11
- +

Arabaya ekle

İstem şimdi

06-8590-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-8950-310C

06-8950-310C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2979 6.11
- +

Arabaya ekle

İstem şimdi

06-8950-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10

40-6513-10

40 POS LOW PROF SOCK SERIES 513

Aries Electronics

3388 6.11
- +

Arabaya ekle

İstem şimdi

- 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-43-628-31-012000

614-43-628-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3109 6.11
- +

Arabaya ekle

İstem şimdi

614-43-628-31-012000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-132-41-013000

346-93-132-41-013000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

2003 6.11
- +

Arabaya ekle

İstem şimdi

346-93-132-41-013000

Datenblatt

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-132-41-013000

346-43-132-41-013000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

3852 6.11
- +

Arabaya ekle

İstem şimdi

346-43-132-41-013000

Datenblatt

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-324-T-A

APA-324-T-A

ADAPTER PLUG

Samtec Inc.

3252 6.12
- +

Arabaya ekle

İstem şimdi

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-T-A

APA-624-T-A

ADAPTER PLUG

Samtec Inc.

2701 6.12
- +

Arabaya ekle

İstem şimdi

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-192-16-001101

510-87-192-16-001101

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3752 5.79
- +

Arabaya ekle

İstem şimdi

510-87-192-16-001101

Datenblatt

Bulk 510 Active PGA 192 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-001101

116-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2656 5.80
- +

Arabaya ekle

İstem şimdi

116-83-642-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-6518-10H

24-6518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2025 6.13
- +

Arabaya ekle

İstem şimdi

24-6518-10H

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3501-20

16-3501-20

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2155 6.13
- +

Arabaya ekle

İstem şimdi

16-3501-20

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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