Fotoğraf | Mfr. Bölüm # | Stock | Ödül | Kıymet | Veri sayfası | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
116-83-640-41-011101CONN IC DIP SOCKET 40POS GOLD |
2579 | 5.86 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
10-3503-30CONN IC DIP SOCKET 10POS GOLD |
2097 | 6.11 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
614-83-964-31-012101CONN IC DIP SOCKET 64POS GOLD |
2099 | 5.88 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-87-201-15-041101CONN SOCKET PGA 201POS GOLD |
2760 | 5.88 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 201 (15 x 15) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
116-83-650-41-008101CONN IC DIP SOCKET 50POS GOLD |
3500 | 6.60 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
714-43-122-31-018000CONN SOCKET SIP 22POS GOLD |
3219 | 6.21 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 714 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
714-43-220-31-018000CONN IC DIP SOCKET 20POS GOLD |
3598 | 6.21 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
06-0511-10CONN SOCKET SIP 6POS TIN |
2333 | 6.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 511 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
30-9513-10TCONN IC DIP SOCKET 30POS GOLD |
2871 | 6.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
19-0513-11HCONN SOCKET SIP 19POS GOLD |
3356 | 6.23 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 0513 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
116-87-650-41-011101CONN IC DIP SOCKET 50POS GOLD |
2167 | 6.61 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
116-83-650-41-002101CONN IC DIP SOCKET 50POS GOLD |
2767 | 6.61 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
124-83-640-41-002101CONN IC DIP SOCKET 40POS GOLD |
3333 | 5.91 |
Arabaya ekleİstem şimdi |
Bulk | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | ||
116-83-628-41-004101CONN IC DIP SOCKET 28POS GOLD |
2365 | 5.92 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-83-128-13-041101CONN SOCKET PGA 128POS GOLD |
3824 | 5.94 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-83-128-13-042101CONN SOCKET PGA 128POS GOLD |
2027 | 5.94 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-83-128-13-043101CONN SOCKET PGA 128POS GOLD |
2663 | 5.94 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-83-128-13-071101CONN SOCKET PGA 128POS GOLD |
3233 | 5.94 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
APA-314-T-BADAPTER PLUG |
2177 | 6.27 |
Arabaya ekleİstem şimdi |
Bulk | APA | Active | - | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | ||
18-3513-10HCONN IC DIP SOCKET 18POS GOLD |
3186 | 6.27 |
Arabaya ekleİstem şimdi |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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