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Fotoğraf Mfr. Bölüm # Stock Ödül Kıymet Veri sayfası Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D01-9972942

D01-9972942

CONN SOCKET SIP 29POS GOLD

Harwin Inc.

2689 0.00
- +

Arabaya ekle

İstem şimdi

D01-9972942

Datenblatt

Tube D01-997 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9973042

D01-9973042

CONN SOCKET SIP 30POS GOLD

Harwin Inc.

2274 0.00
- +

Arabaya ekle

İstem şimdi

D01-9973042

Datenblatt

Tube D01-997 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9973142

D01-9973142

CONN SOCKET SIP 31POS GOLD

Harwin Inc.

3301 0.00
- +

Arabaya ekle

İstem şimdi

D01-9973142

Datenblatt

Tube D01-997 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0724-01

D0724-01

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

3686 0.00
- +

Arabaya ekle

İstem şimdi

D0724-01

Datenblatt

Bulk D0 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0724-42

D0724-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2527 0.00
- +

Arabaya ekle

İstem şimdi

D0724-42

Datenblatt

Bulk D0 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0806-01

D0806-01

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

3577 0.00
- +

Arabaya ekle

İstem şimdi

D0806-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0806-42

D0806-42

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

2304 0.00
- +

Arabaya ekle

İstem şimdi

D0806-42

Datenblatt

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95020-42

D95020-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

2787 0.00
- +

Arabaya ekle

İstem şimdi

D95020-42

Datenblatt

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95022-42

D95022-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

3023 0.00
- +

Arabaya ekle

İstem şimdi

D95022-42

Datenblatt

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95024-42

D95024-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2753 0.00
- +

Arabaya ekle

İstem şimdi

D95024-42

Datenblatt

Bulk D95 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95028-42

D95028-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

2696 0.00
- +

Arabaya ekle

İstem şimdi

D95028-42

Datenblatt

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0808-01

D0808-01

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

3223 0.00
- +

Arabaya ekle

İstem şimdi

D0808-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0814-01

D0814-01

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

2024 0.00
- +

Arabaya ekle

İstem şimdi

D0814-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0814-42

D0814-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

2454 0.00
- +

Arabaya ekle

İstem şimdi

D0814-42

Datenblatt

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0816-01

D0816-01

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

2198 0.00
- +

Arabaya ekle

İstem şimdi

D0816-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0818-01

D0818-01

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

3629 0.00
- +

Arabaya ekle

İstem şimdi

D0818-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0818-42

D0818-42

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

3551 0.00
- +

Arabaya ekle

İstem şimdi

D0818-42

Datenblatt

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0820-01

D0820-01

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

2869 0.00
- +

Arabaya ekle

İstem şimdi

D0820-01

Datenblatt

Bulk D0 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0820-42

D0820-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

3692 0.00
- +

Arabaya ekle

İstem şimdi

D0820-42

Datenblatt

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D0822-01

D0822-01

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

3852 0.00
- +

Arabaya ekle

İstem şimdi

D0822-01

Datenblatt

Bulk D0 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
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